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The perovskite-structured SrSnO3 possessing steady capacitance over the temperature range between 27°C and 300°C in a frequency domain spanning nearly four decades has been evaluated. The samples inve...
First observation of switching behavior is reported in GaAs metal-insulator-p-n+ structure, where the thin insulator is grown at low temperature by a liquid phase chemical-enhanced oxide (LPECO) with ...
Multilayer ceramic capacitors designed to be embedded in a low temperature co-fired ceramic substrate have been successfully fabricated. Low and high value capacitors were respectively embedded in the...
The a-SiC/c-Si(n) isotype heterojunction has been studied as a temperature sensor by measuring its reverse current-voltage (IR−V) and reverse voltage-temperature (V-T) characteristics, as well a...
Electronic energy is calculated explicitly for itinerant-electron metamagnetic materials at very low temperature. This calculation involves bandwidth and consequently volume, and it has been performed...
Undoped and Ge-doped ITO films (ITO: Ge) deposited at low temperature (70℃) have been studied. Although both samples have the same carrier concentration, a higher carrier mobility occurs for ITO: Ge. ...
Thick film resistors were prepared with different variables, they included various conductive particle sizes, glass particle sizes, glass softening temperatures, thermal expansion coefficients of the ...
The preparation and properties of the Pb(Fe2/3W1/3)x(Fe1/2Nb1/2)0.86–xTi0.14O3-based thick film dielectrics are described. The Calcined Pb(Fe2/3W1/3)O3 powder, instead of glass frit, is used as the fl...
Thick Ni-P films have been widely investigated at our Institute. This article tends to visualize by use of various microscopic methods how the growth and sintering of individual conducting grains, res...
Thick film resistors made of typical ruthenate pastes on various dielectrics change their properties. The properties of such resistors, fabricated on the TiO2 + glass dielectric, have been evaluated i...
One of the reasons for a reduction of production quality is the so-called ‘hidden faults’, i.e. defects which will not be detected by the available testing equipment in spite of measures for ensuring ...
The present paper is devoted to the technological problems connected with the construction, the choice of pastes and substrates, the screening process and the laser or abrasive trimming involved in th...

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