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日本东北大学研究生院工学研究科智能元件材料学专业教授小池淳一的研究小组开发出了用于氧化物半导体TFT驱动的液晶面板、基于Cu-Mn合金的布线工艺,并在有源矩阵型显示器国际学会“AM-FPD10”(2010年7月5~7日,在东京工业大学举行)上发表了演讲(演讲序号:4-2)。与目前液晶面板中使用的Al布线相比,Cu布线的电阻要低1/2左右,因而可缩小面板布线的RC延迟。该工艺主要面向大尺寸液晶面板“...
形变时效工艺对低铍Cu-Ni-Be合金力学性能和电导率的影响
Cu-Ni-Be合金 形变时效 力学性能 电导率
2011/1/14
运用正交设计研究形变时效工艺(冷变形量、时效温度和时效时间)对低铍含量Cu-Ni-Be合金力学性能和电导率的影响,并通过光学显微镜、扫描电镜和透射电镜对其显微组织进行分析。研究结果表明:在形变时效处理的3个主要工艺参数中,时效时间对抗拉强度、屈服强度和相对电导率的影响最大,时效温度次之,冷变形量最小;合金在经过37.5%冷变形的轧制后,在470 ℃时效2 h,γ″析出物细小且弥散分布在基体中,合金...
掺氟对Y-Ba-Cu-O高温超导体电子结构的影响
Y-Ba-Cu-O超导体 氟掺杂 态密度
2008/8/15
采用Recursion方法计算了不同掺氟量和不同替代位置下Y-Ba-Cu-O的电子结构,
从掺氟Y-Ba-Cu-O各晶位的态密度(DOS), 可进一步得到Fermi能EF、
Fermi能级处的态密度N(EF)以及各晶位原子价等重要数据. 各模型的计算
结果表明, 掺入氟后引起CuO2平面上Cu的原子价升高和O的价位变得更负,
使Cu位空穴数目增加和O位空穴数目减少, 且以后者的变化为主. ...
Comparative Study of Statistical Distributions in Electromigration-Induced Failures of Al/Cu Thin-Film Interconnects
Statistical Distributions Electromigration-Induced Failures Al/Cu Thin-Film Interconnects
2010/12/15
In electromigration failure studies, it is in general assumed that electromigration-induced failures may be adequately modelled by a log-normal distribution. Further to this, it has been argued that a...
Relationship Among Preparation, Structure and Superconductivity in Ti-Ca-Ba-Cu-O Compounds
Ti-Ca-Ba-Cu-O Compounds Preparation Structure Superconductivity
2010/12/16
Analysis of a comprehensive set of experimental results has proven the substantial effect of the precise preparation conditions upon the structure and superconducting parameters of Ti-Ca-Ba-Cu-O sampl...
The Textural Effect of Cu Doping and the Electronic Effect of Ti, Zr and Ge Dopings Upon the Physical Properties of In2O3 and Sn-Doped In2O3 Ceramics
Cu In2O3 Sn-Doped In2O3 Ceramics
2010/12/16
The electronic properties of Cu-, Ti-, Zr-, and Ge-doped In2O3 (IO) and ITO (Sn-doped In2O3) ceramics are investigated. We distinguish the different effect of Cu doping (so called the “textural effect...
Superconducting Thick-Films From a Y-Ba-Cu-O Precursor
thick film super conduction high temperature superconductors
2010/12/16
We have prepared screen-printed films of the Y-Ba-Cu-O compound starting from a spray-pyrolysis precursor powder. BeO ceramic substrates are confirmed to be inert with respect to the film up to about ...
Screen-Printed Superconducting Y-Ba-Cu-O Thick Films on Various Substrates
the Y-Ba-Cu-O system the substrate material the superconducting properties of the films
2010/12/21
Superconducting thick films of the Y-Ba-Cu-O system prepared by screen-printing and sintering on different substrates were investigated to study the effect of the substrate material on the superconduc...
Electrical Properties of RF Sputtered NiCr Thin Film Resistors With Cu Contacts
Electrical Properties RF Sputtered NiCr Thin Film Resistors Cu Contacts
2010/12/23
Investigations on RF sputtered NiCr thin film resistors, fabricated using Cu as conductor metallization, were made. The contact resistance characteristics, resistor film characteristics and TCR of the...