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Non-planar surface may cause incorrect transfer of patterns during lithography. In today’s IC manufacturing, chemical mechanical polishing (CMP) is used for topographical planarization. Since polish r...
Poly(3,4-ethylene dioxythiophene) (PEDOT) has been inserted between the layers of crystalline V2O5 via the in situ polymerization of EDOT within the framework of the oxyde. The insertion increases the...
We propose an unconventional method to obtain fine-grained SnO2 and WO3 powders. It uses as precursors, polymer complexes between polyethylene oxide (POE) and SnCl4 or WCl6 respectively. By pyrolysis ...
Fine grained SnO2 powders have been obtained using an unconventional method. It deals with the well known polymerization method starting from the metallic halide SnCl4 with polyethylene oxide (PEO). W...
A new family of insertion-compound electrodes, so called NCIMs (Nano-Crystallite-Insertion-Materials), has been proposed: the major requirement is that the electrode materials have to be polycrystalli...
Thin films of lithium-nickel oxide, whose texture consists of microcrystallites with an average grain size of 50 Å, permit highly reversible electrochemical insertion of lithium ions in Li+ cond...

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