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Feature-scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics
Chemical mechanical polishing smoothed particle hydrodynamics particulate flow rough pad wafer defects abrasive concentration
2014/10/10
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes are investigated in detail by the smoothed particle hydrodynamics (SPH) method. The feature-scale beh...